Small Batch Wafer Electroplating Line

Areas of application: Pillar, Bump, RDL, TSV, Damascus CU etc;

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Product Overview

1. Areas of application: Pillar, Bump, RDL, TSV, Damascus CU etc;

2. Wafer size: 150mm & 200mm & 300mm (customizable);

3. Process index: high uniformity: WiW≤3%, WtW≤3%

4. Equipment features:

◎ The number of cavities 1-4 can be customized;

◎ Man-machine interface touch screen operation control, convenient and fast;

◎ Horizontal electroplating chamber, no cross contamination;

◎ Small size, high flexibility;

◎ Modular production, easy maintenance;

◎ Coating type: Cu, Ni, Au, Sn, Ag.

Small Batch Wafer Plating Line