ECP Series Automatic Wafer ( Horizontal ) Plating Machine
(1) Application fields: Pillar,Bump,RDL,TSV and other processes
(2) Wafer size: 150mm&200mm&300mm (customizable)
(3) Process index: high uniformity: WiW≤3%, WtW≤3%, RtR≤3%
Product Overview
(1) Application fields: Pillar,Bump,RDL,TSV and other processes
(2) Wafer size: 150mm&200mm&300mm (customizable)
(3) Process index: high uniformity: WiW≤3%, WtW≤3%, RtR≤3%
(4) Equipment features:
◎ Equipped with 3 Load ports
◎ Industrial control machine touch screen operation control, convenient and fast
◎ Use genuine industrial iot configuration software for control and monitoring
◎ Support SECS/GEM communication protocol and data transmission
◎ Horizontal plating chamber, no cross contamination
◎ Equipped with two-arm wafer handling manipulator imported from Japan, efficient and stable
◎ Equipped with 2 prepreg cavities
◎ Equipped with up to 8 plating cavities (customized)
◎ Equipped with 2 cleaning chambers
◎ Equipped with 2 drying chambers
◎ Equipped with automatic addition system
◎ Coating type: Cu,Ni,Au,Sn,Ag
Our products are very popular, if you are interested in our products, please contact us as soon as possible. Email: jyn@jyn-online.com
Product Name: ECP Series Automatic Wafer ( Horizontal ) Plating Machine
