Automatic Wafer ( Vertical ) Plating Machine-ECP Series

Application Fields

The Automatic Wafer (Vertical) Plating Machine is built for advanced semiconductor manufacturing applications. It is particularly suited for:

• Pillar

• Bump

• RDL (Redistribution Layer)

• TSV (Through Silicon Via)

• Other specialized processes

Product Specification

 Wafer size: 150mm&200mm (customizable)

 Process index: high uniformity: WiW≤3%, WtW≤3%, RtR≤3%

Product Feature

• Advanced Load Port Configuration

JuYongNengt automatic wafer (vertical) plating machine is equipped with 3 load ports, enabling seamless wafer loading and unloading. This feature ensures continuous operation and higher throughput, making it ideal for large-scale manufacturing environments.

• User-Friendly Control Interface

Operating the plating machine is made easy with its industrial control machine touch screen interface. This system provides fast and convenient control, allowing operators to adjust settings and monitor the plating process in real time. 

• Advanced Communication Protocols

For seamless system integration, our automatic wafer (vertical) plating machine supports the SECS/GEM communication protocol. This allows for smooth data transmission between the machine and other factory systems, facilitating efficient communication in smart manufacturing environments.

• Vertical Electroplating Chamber

The machine's vertical electroplating chamber is designed for easy maintenance while ensuring uniform coating. This vertical design not only improves process consistency but also reduces downtime, allowing for higher productivity.

• Double-Sided Automatic Fixture

One of the standout features of JuYongNeng wafer plating machine is its automatic double-sided fixture. This innovative design improves production efficiency by processing both sides of the wafer simultaneously.

• High-Precision Wafer Handling

Our plating system is equipped with a two-arm wafer handling manipulator imported from Japan. Known for its efficiency and stability, this component ensures that wafers are handled with precision, reducing the risk of damage and ensuring consistent placement during the plating process.

• Multiple Plating and Processing Chambers

2 Prepreg Cavities: Prepares wafers for the plating process.

Up to 8 Plating Cavities (customizable): This allows for simultaneous processing of multiple wafers, improving throughput and efficiency.

2 Cleaning Chambers and 2 Drying Chambers: Ensures that each wafer is thoroughly cleaned and dried post-plating for optimal results.

• Automatic Addition System and Coating Types

1. Copper (Cu)

2. Nickel (Ni)

3. Gold (Au)

4. Tin (Sn)

5. Silver (Ag)

Learn more about JuYongNeng's high-precision Semiconductor Machines.