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JT Copper Etching Line

Model No.: JT-75/ JT-85


Precision Control with Spray Pump Technology


Durable and Accurate Spray Plate Design


High-Quality Nozzle System for Precision Etching


Advanced Filtration System

Product Overview

The Copper Etching Line from JYN directly impacts the success of copper balancing in PCB fabrication. By ensuring uniform copper removal, it enhances product durability, signal integrity, and mechanical strength. Furthermore, copper balance during fabrication prevents low-pressure areas that may lead to design failures, ensuring high-yield production runs.

Product Parameters


NameTSP
Max

JT-75: 660 mm*660mm

JT-85: 762 mm*762mm

Min220mm*220mm
Substrate Thickness0.05-1.2mm /0.3-6.0mm
Applicable ProcessCopper Reduction after Horizontal ELectrolytic Plating, Copper Reduction after Lamination


Characteristics of JT Copper Etching Line


1. Precision Control with Spray Pump Technology


The Copper Etching Line is equipped with a spray pump featuring a frequency converter. This setup ensures convenient, accurate, and rapid pressure adjustments, optimizing the copper reduction process.


2. Durable and Accurate Spray Plate Design


The copper reduction section's spray plate is constructed from CPVC integrated whole plate CNC cutting. This process provides a stable structure with high strength and accuracy, enhancing the efficiency of the Copper Etching Line.


3. High-Quality Nozzle System for Precision Etching


For precision etching, the nozzle covers, cores, and seats in the steel reduction section are imported from Germany (Lexler brand). This ensures long service life and superior spraying accuracy, vital for maintaining the integrity of the Copper Etching Line.


4. Advanced Filtration System


The Copper Etching Line features an integrated PP barrel body filter, which is highly durable. It uses six 15-inch cotton cores to provide large filtering areas and high accuracy, ensuring copper reduction uniformity of 95% or higher.


Importance of Copper Balance in PCB Fabrication


The Copper Etching Line plays a crucial role in maintaining copper balance during PCB fabrication. By using advanced spray technology and precision nozzles, the Copper Etching Line ensures even copper reduction across the board. This prevents mechanical defects and improves overall PCB performance.


Understanding PCB Fabrication and Copper Balance


PCB Fabrication involves transforming a circuit design into a physical board. One critical aspect of this process is achieving copper balance, ensuring uniform copper distribution across the PCB's layers. This balance helps avoid electrical and mechanical issues that could hinder circuit performance.


Significance of Copper Balance in PCB Design


Copper balance refers to the symmetrical distribution of copper traces across each layer of the PCB stack-up. This prevents board defects such as twisting, bowing, or warping. Fabricators and layout engineers recommend mirrored stack-ups to maintain copper balance and avoid structural deformities.


JT Copper Etching Line


Key Benefits of Copper Balance in PCB Fabrication


1. Preventing Mechanical Defects


Twisting, bowing, and warping can occur when copper distribution is uneven. The Copper Etching Line addresses this by ensuring uniform copper removal, thus reducing the risk of board deformation.


2. Enhancing Thermal and Electrical Performance


Copper is vital for heat dissipation and signal transmission. Proper copper balance minimizes irregular heating and improves conductor thickness, enhancing the PCB's reliability and efficiency.


3. Reducing Production Costs


Balanced copper reduces the need for additional heat sink components. By using a Copper Etching Line, manufacturers can cut production costs while maintaining product quality.


Achieving Copper Balance During PCB Design


1. Layer Symmetry and Stack-Up Design


To prevent bowing or twisting, PCB designers should ensure the central layer has the maximum copper thickness. The remaining layers should mirror each other in copper distribution, ensuring structural stability.


2. Grid Design for Wide Copper Areas


Instead of solid copper planes, designers should create grids in wide copper areas. This approach minimizes copper density mismatches and enhances copper balance.


3. Symmetrical Power Planes


Power planes must be symmetrically placed, and copper weight should be consistent across all layers. This prevents mechanical stress during lamination.


JT Copper Etching Line


The Copper Etching Line is essential in achieving copper balance in PCB fabrication. From precision control to high-accuracy nozzles, every component contributes to superior copper reduction, JYN ensuring PCB boards meet the highest standards. Incorporating copper balance techniques into the design phase enhances overall production quality, making our Copper Etching Line an indispensable tool in modern PCB manufacturing. Investing in JYN's wet process equipment will bring an unparalleled experience to your PCB/SMT production.

Our products are very popular, if you are interested in our products, please contact us as soon as possible. Email: jyn@jyn-online.com

Product Name: JT Copper Etching Line

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